Title :
Traveling-wave microwave fiber-optic links
Author :
Hashim, Hasnul H. ; Iezekiel, Stavros
Author_Institution :
Inst. of Microwaves & Photonics, Univ. of Leeds, UK
Abstract :
A traveling-wave microwave fiber-optic link (TW MFL) is proposed and demonstrated for the first time. The structure is electrically equivalent to a traveling-wave microwave amplifier in which the transistors are replaced by individual optical fiber link elements using laser diode (LD)-photodiode (PD) pairs. This results in two transmission-line structures that are periodically loaded with LDs and PDs, respectively, and connected to one another by a fiber array. A three-element TW MFL has been constructed using commercially available components to demonstrate the concept. Over the design bandwidth of 200 MHz-2 GHz, the input and output return loss is better than approximately 10 dB each, while the link gain of -20 dB is in agreement with simulation results. The link gain is seen to increase as the number of link elements is increased. Measured S-parameter results also show the deleterious impact of terminating impedance mismatches and optical delay detuning on the TW MFL´s frequency response.
Keywords :
S-parameters; high-frequency transmission lines; microwave amplifiers; microwave photonics; optical communication equipment; optical fibre communication; photodiodes; semiconductor lasers; travelling wave amplifiers; -20 dB; 0.2 to 2 GHz; S parameters; frequency response; impedance mismatch; input return loss; laser diode-photodiode pair; microwave fiber-optic links; optical delay detuning; optical fiber link elements; output return loss; transmission-line structures; traveling-wave microwave amplifier; Bandwidth; Diode lasers; Magnetic flux leakage; Microwave amplifiers; Microwave transistors; Optical fiber amplifiers; Optical fibers; Optical losses; Semiconductor optical amplifiers; Transmission lines; Laser diode (LD) array; microwave fiber-optic links; photodetector array; traveling wave;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2005.863034