DocumentCode
822806
Title
There may be trouble ahead [integrated circuit design]
Author
Collins, Leslie
Volume
51
Issue
12
fYear
2005
Firstpage
44
Lastpage
47
Abstract
This paper provides some strategies that can help IC designers deal with problems arising from the emergence of advanced manufacturing techniques with minimum dimensions of less than 100 nm. Many of the physical effects that could be ignored in less dense processes are now becoming painfully apparent, making design significantly more difficult and prompting some engineers to reconsider their use of the latest processes. To address this problem, one of the options is to design circuits and systems that achieve fault tolerance using redundancy and other mechanisms. Another option is to use hardware that recognizes when a circuit hasn´t performed correctly and uses a built-in recovery mechanism to get the circuit to repeat the desired operation. The availability of multiple central processing units on one chip is expected to change system design as well as significantly increase the opportunity to be constructive in defect tolerance.
Keywords
circuit CAD; fault tolerance; integrated circuit design; integrated circuit reliability; nanoelectronics; IC designers; built-in recovery mechanism; fault tolerance; integrated circuit design; multiple central processing units;
fLanguage
English
Journal_Title
IEE Review
Publisher
iet
ISSN
0953-5683
Type
jour
DOI
10.1049/ir:20051205
Filename
1589580
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