• DocumentCode
    822806
  • Title

    There may be trouble ahead [integrated circuit design]

  • Author

    Collins, Leslie

  • Volume
    51
  • Issue
    12
  • fYear
    2005
  • Firstpage
    44
  • Lastpage
    47
  • Abstract
    This paper provides some strategies that can help IC designers deal with problems arising from the emergence of advanced manufacturing techniques with minimum dimensions of less than 100 nm. Many of the physical effects that could be ignored in less dense processes are now becoming painfully apparent, making design significantly more difficult and prompting some engineers to reconsider their use of the latest processes. To address this problem, one of the options is to design circuits and systems that achieve fault tolerance using redundancy and other mechanisms. Another option is to use hardware that recognizes when a circuit hasn´t performed correctly and uses a built-in recovery mechanism to get the circuit to repeat the desired operation. The availability of multiple central processing units on one chip is expected to change system design as well as significantly increase the opportunity to be constructive in defect tolerance.
  • Keywords
    circuit CAD; fault tolerance; integrated circuit design; integrated circuit reliability; nanoelectronics; IC designers; built-in recovery mechanism; fault tolerance; integrated circuit design; multiple central processing units;
  • fLanguage
    English
  • Journal_Title
    IEE Review
  • Publisher
    iet
  • ISSN
    0953-5683
  • Type

    jour

  • DOI
    10.1049/ir:20051205
  • Filename
    1589580