مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

823168

Title :

Future chips feel the heat

Author :

Edwards, Chris

Volume :

Issue :

fYear :

2006

Firstpage :

Abstract :

The chip industry is coming up with ingenious ways to tackle heating effects in the latest densely packed devices. In particular carbon nanotubes are mentioned.

Keywords :

carbon nanotubes; heat transfer; transistors; carbon nanotubes; electron impacts; heat transfer; heating effects; transistors;

fLanguage :

English

Journal_Title :

IEE Review

Publisher :

iet

ISSN :

0953-5683

Type :

jour

DOI :

10.1049/ir:20060101

Filename :

1589819

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=823168