Title :
S-parameter analysis of multiconductor, integrated circuit interconnect systems
Author :
Cooke, Bradly J. ; Prince, John L. ; Cangellaris, Andreas C.
Author_Institution :
Los Alamos Nat. Lab., NM, USA
fDate :
3/1/1992 12:00:00 AM
Abstract :
The authors explore the use of S-parameter-based network techniques for the analysis of coupled, multiconductor, high-speed analog and digital integrated circuit interconnects. S-parameter-based computer-aided design (CAD) techniques, widely used in microwave network analysis, provide a powerful framework for the analysis of analog and digital integrated circuit interconnect systems. The specific additions to the existing S-parameter network analysis framework developed provide for multiport interconnect capabilities and for the use of multiconductor S-parameters derived from three categories of input parameters: (1) lossy quasi-static R,L,C and G; (2) lossy frequency-dependent (dispersive) R,L ,C,G; and (3) the propagation constants, characteristic impedance, and conductor eigencurrents, derived from full-wave electromagnetic analysis. Results are compared with computed simulations and experimental measurements
Keywords :
S-parameters; circuit analysis computing; digital integrated circuits; linear integrated circuits; matrix algebra; monolithic integrated circuits; packaging; CAD; S-parameter analysis; analogue IC; characteristic impedance; computer-aided design; conductor eigencurrents; digital IC; integrated circuit; interconnect systems; multiconductor; multiport interconnect capabilities; network analysis; propagation constants; Coupling circuits; Design automation; Digital integrated circuits; Electromagnetic analysis; Frequency; Integrated circuit interconnections; Microwave theory and techniques; Power system interconnection; Propagation losses; Scattering parameters;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on