Title :
Heat-resistant epoxy-silicon hybrid materials for printed wiring boards
Author :
Takahashi, Akio ; Satsu, Yuichi ; Nagai, Akira ; Umino, Morimichi ; Nakamura, Yoshihiro
Author_Institution :
Hitachi Ltd., Japan
fDate :
4/1/2005 12:00:00 AM
Abstract :
An epoxy-silicon hybrid resin based on a new concept has been developed. This resin has a structure in which epoxy-silicon oligomers by sol-gel reaction are incorporated into the epoxy resin matrix at the nanometer level. The nanostructure was confirmed by 29Si NMR spectrum and a time-resolved energy filtering-transmission electron microscopy technique. This epoxy-silicon hybrid resin shows excellent mechanical properties at high temperatures. The elastic modulus at 260°C was 0.6 GPa, much higher than the 0.08 GPa of conventional epoxy resins; and the thermal expansion coefficient above the glass transition temperature was two-thirds of the conventional one. It was confirmed that conventional fabrication process for FR-5 was applicable to copper clad laminates for the epoxy-silicon hybrid resin.
Keywords :
copper; electron microscopy; mechanical properties; nanotechnology; polymers; printed circuits; silicon; thermal expansion; 260 C; Cu; FR-5; NMR spectrum; Si; copper clad laminates; electron microscopy; energy filtering-transmission; epoxy resin matrix; epoxy-silicon hybrid resin; epoxy-silicon oligomers; glass transition temperature; heat-resistant epoxy-silicon hybrid materials; mechanical properties; nanometer level; printed wiring boards; sol-gel reaction; thermal expansion coefficient; Electron microscopy; Epoxy resins; Fabrication; Glass; Mechanical factors; Nanostructured materials; Nuclear magnetic resonance; Temperature; Thermal expansion; Wiring; Copper-clad laminate; FR-5; Pb-free solder; epoxy–silicon hybrid resin; heat-resistant material; printed wiring board; sol–gel reaction;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2005.846831
