Title :
10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006)
fDate :
4/1/2005 12:00:00 AM
Abstract :
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2005.851201
