Title :
Samarium and manganese-doped lead titanate ceramic fiber/epoxy 1-3 composite for high-frequency transducer application
Author :
Li, Kun ; Chan, Helen L W ; Choy, Chung L.
Author_Institution :
Dept. of Appl. Phys., Hong Kong Polytech. Univ., Kowloon, China
Abstract :
Samarium- (Sm) and manganese- (Mn) doped lead titanate ceramic fibers with a diameter of 35 /spl mu/m were prepared using a sol-gel method. The X-ray diffraction pattern shows that the fibers have a pure perovskite structure. The 1-3 composite disks with a thickness of 31-41 /spl mu/m and with ceramic volume fraction of /spl sim/0.68 have been prepared using the samarium and manganese doped lead titanate (PSmT) fibers. The resonance characteristics of the poled composite disks were measured. A focused transducer was fabricated using a concave 1-3 composite disk with nonuniform thickness in order to enhance its bandwidth. The insertion loss (IL), pulse-echo response and frequency spectrum of the composite transducer were measured. The center frequency of the transducer was /spl sim/31 MHz with a -3 dB bandwidth of /spl sim/123% and a low IL of 29.3 dB.
Keywords :
X-ray diffraction; fibre reinforced composites; losses; sol-gel processing; ultrasonic transducers; 29.3 dB; 31 MHz; 31 to 41 micron; 35 micron; X-ray diffraction pattern; ceramic volume fraction; fiber/epoxy 1-3 composite; frequency spectrum; high-frequency transducer application; insertion loss; nonuniform thickness; poled composite disks; pulse-echo response; resonance characteristics; sol-gel method; Bandwidth; Ceramics; Frequency; Manganese; Pulse measurements; Resonance; Samarium; Titanium compounds; Transducers; X-ray diffraction; Ceramics; Electric Impedance; Equipment Failure Analysis; Lead; Manganese; Manufactured Materials; Materials Testing; Molecular Conformation; Phase Transition; Reproducibility of Results; Samarium; Sensitivity and Specificity; Titanium; Transducers; Ultrasonography; X-Ray Diffraction;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2003.1244754