DocumentCode :
824049
Title :
Time-domain electromagnetic analysis of interconnects in a computer chip package
Author :
Becker, Wiren D. ; Harms, Paul H. ; Mittra, Raj
Author_Institution :
Electromagn. Commun. Lab., Illinois Univ., Urbana, IL, USA
Volume :
40
Issue :
12
fYear :
1992
fDate :
12/1/1992 12:00:00 AM
Firstpage :
2155
Lastpage :
2163
Abstract :
The determination of an equivalent circuit to approximate the behavior of an interconnect in a computer package is addressed. Equivalent circuits allow the analysis of a complete interconnect path in a circuit simulator where a full-wave analysis tool would require more memory or computer time than in currently available. Two important components of an interconnect in a computer package are uniform transmission lines, such as a microstrip line or a stripline, and discontinuities in the interconnects, such as a via between two transmission lines. A methodology for deriving a frequency-dependent description of coupled transmission lines and an equivalent circuit of a via using time-domain full-wave solutions of Maxwell´s equations is presented
Keywords :
equivalent circuits; microstrip components; packaging; strip line components; time-domain analysis; Maxwell´s equations; circuit simulator; computer chip package; coupled transmission lines; discontinuities; electromagnetic analysis; equivalent circuit; frequency-dependent description; interconnects; microstrip line; stripline; time-domain full-wave solutions; uniform transmission lines; via; Analytical models; Circuit analysis; Circuit simulation; Computational modeling; Distributed parameter circuits; Electromagnetic analysis; Equivalent circuits; Integrated circuit interconnections; Packaging; Time domain analysis;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.179876
Filename :
179876
Link To Document :
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