Title :
An 800-MHz embedded DRAM with a concurrent refresh mode
Author :
Kirihata, Toshiaki ; Parries, Paul ; Hanson, David R. ; Kim, Hoki ; Golz, John ; Fredeman, Gregory ; Rajeevakumar, Raj ; Griesemer, John ; Robson, Norman ; Cestero, Alberto ; Khan, Babar A. ; Wang, Geng ; Wordeman, Matt ; Iyer, Subramanian S.
Author_Institution :
Technol. Group, IBM Syst., Hopewell Junction, NY, USA
fDate :
6/1/2005 12:00:00 AM
Abstract :
An 800-MHz embedded DRAM macro employs a memory cell utilizing a device from the 90-nm high-performance technology menu; a 2.2-nm gate oxide 1.5 V IO device. A concurrent refresh mode is designed to improve the memory utilization to over 99% for a 64 μs data retention time. A concurrent refresh scheduler utilizes up-count and down-count registers to identify at least one array to be refreshed at every clock cycle, emulating a classical distributed refresh mode. A command multiplier employs low frequency phased clock signals to generate the clock, commands, and addresses at rates up to 4× that of the tester frequency. The macro integrates masked redundancy allocation logic during at speed multibank test. The hardware results show a 312-MHz random access frequency and 800-MHz multibank frequency at 1.2 V, respectively.
Keywords :
DRAM chips; UHF integrated circuits; multiplying circuits; nanoelectronics; shift registers; 1.2 V; 1.5 V; 2.2 nm; 312 MHz; 800 MHz; 90 nm; command multiplier; concurrent refresh mode; concurrent refresh scheduler; down-count registers; embedded DRAM; high-performance cell; low frequency phased clock signals; masked redundancy allocation logic; memory cell; random access frequency; speed multibank test; up-count registers; Cache memory; Clocks; Frequency; Hardware; Logic devices; Logic testing; Random access memory; Registers; Signal generators; Threshold voltage; Command multiplier; concurrent refresh mode; embedded DRAM; high-performance cell; refresh scheduler;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2005.848019