A semi-analytical method to predict printed circuit board package temperatures

Author

Funk, John N. ; Menguc, M. Pinar ; Tagavi, Kaveh A. ; Cremers, Clifford J.

Author_Institution

Dept. of Mech. Eng., Kentucky Univ., Lexington, KY, USA

Volume

15

Issue

5

fYear

1992

fDate

10/1/1992 12:00:00 AM

Firstpage

675

Lastpage

684

Abstract

A quick, easy-to-use method is developed to predict steady-state temperatures on printed circuit boards (PCBs) subjected to heating by single or multiple heat sources. The method includes separate analytical solutions for the circuit board and for the chips to be mounted on the board. The board solution is developed using the Green´s function method for solving the heat diffusion equation in the board. For the chip, the solution of the heat diffusion equation is obtained using the method of separation of variables. The temperature solution for the package is determined using an iterative procedure between the chip model and the board model. The accuracy of the method is verified by comparison with detailed finite element techniques

Keywords

Green´s function methods; finite element analysis; packaging; printed circuits; Green´s function method; PCB package temperature prediction; analytical solutions; board solution; easy-to-use method; finite element techniques; heat diffusion equation; iterative procedure; multiple heat sources; printed circuit boards; semi-analytical method; separation of variables; steady-state temperatures; temperature solution; Electronic packaging thermal management; Electronics packaging; Equations; Heat transfer; Integrated circuit packaging; Power engineering computing; Printed circuits; Steady-state; Temperature distribution; Temperature sensors;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.180030

Filename

180030