A technique for enhancing boiling heat transfer with application to cooling of electronic equipment

Particle layering is introduced as an effective and convenient technique for enhancing boiling nucleation on a surface. Because it can be applied without stress or damage to a surface, it may be implemented in immersion cooling, with boiling, of electronic equipment components. Such an enhanced surface, which has an increased number of nucleation sites, shows a decreased level of wall superheat under boiling and an increased critical heat flux (CHF) relative to superheat and CHF values for an untreated surface. Application of this technique results in a decrease of heated surface temperature and a more uniform temperature of the heated surface; both effects are important in immersion cooling of electronic equipment