Interconnect technologies and the thermal performance of MCM

Author

Ozmat, Burhan

Author_Institution

Texas Instruments, Dallas, TX, USA

Volume

15

Issue

5

fYear

1992

fDate

10/1/1992 12:00:00 AM

Firstpage

860

Lastpage

869

Abstract

The thermal performances of multichip modules (MCMs) are compared on the basis of their interconnection technologies. The comparisons are made for hermetic and conduction cooled use environments. The thermal performances of the chip-first-type high density interconnect (HDI) technology, the flipped chip (FCP) technology, and the flipped tape automated bond (FTAB) technology are analyzed and compared for the MCM applications. The results show the thermal performance of each interconnect technology and the most effective ways of improving the performance of MCMs

Keywords

cooling; digital simulation; finite element analysis; flip-chip devices; multichip modules; packaging; tape automated bonding; FCP; FTAB; HDI; MCM; finite element analysis; flipped chip; flipped tape automated bond; high density interconnect; interconnection technologies; multichip modules; thermal performance; Composite materials; Dielectric materials; Dielectric substrates; Multichip modules; Packaging; Performance analysis; Thermal conductivity; Thermal expansion; Thermal factors; Thermal resistance;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.180052

Filename

180052