DocumentCode :
825505
Title :
Surface accumulation rate of diffusing species on thin gold electroplates
Author :
Révay, Laszlo
Author_Institution :
Ericsson Telecom, Stockholm, Sweden
Volume :
15
Issue :
5
fYear :
1992
fDate :
10/1/1992 12:00:00 AM
Firstpage :
870
Lastpage :
875
Abstract :
The accumulated species on the surface of Co-hardened gold electroplates were analyzed. The samples were aged in a basement air environment at 85, 125, and 150°C for periods of 1-12 mo. Different gold coating thicknesses were used, 0.3 and 1.0 μm, on phosphor bronze substrates with or without 5-μm nickel underplate. The accumulation rates of surface films were evaluated using contact resistance probing. Auger electron spectroscopy was employed to characterize the surface species. The values of contact resistance recorded are consistent with parabolic growth kinetics and have been utilized to extrapolate estimated lifetimes based on the failure criteria of increases in contact resistance to 20, 50, and 100 mΩ
Keywords :
ageing; cobalt alloys; contact resistance; electrical contacts; electroplated coatings; environmental testing; gold alloys; life testing; materials testing; 0.0833 to 1.0 y; 0.4 to 1.0 micron; 20 to 100 mohm; 85 to 150 C; Au-Co electroplates; Auger electron spectroscopy; CuSnP-AuCo; CuSnP-Ni-AuCo; accumulation rates of surface films; basement air environment; contact resistance; diffusing species; failure criteria; lifetime extrapolation; parabolic growth kinetics; surface species; Aging; Coatings; Contact resistance; Electrons; Gold; Kinetic theory; Nickel; Phosphors; Spectroscopy; Surface resistance;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.180053
Filename :
180053
Link To Document :
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