DocumentCode :
825980
Title :
Embedded Stress Sensors for Strained Technologies Process Control
Author :
Kasbari, Moustafa ; Delamare, Romain ; Blayac, Sylvain ; Rivero, Christian ; Fortunier, Roland
Author_Institution :
Centre de Microelectron. de Provence, Ecole des Mines de St.- Etienne, Gardanne
Volume :
21
Issue :
3
fYear :
2008
Firstpage :
352
Lastpage :
357
Abstract :
Mechanical stress management becomes a major issue for state-of-the-art CMOS technologies. Mechanical stress induced by the process steps is often at the origin of yield losses but also opportunities for technologies performance enhancement. Usual methods for mechanical stress measurement generally require offline measurements and are not compatible with fast correction of process parameters. We propose here embedded stress piezoresistive sensors to allow fast monitoring of mechanical stress and enable real time correction of the process parameters. The test vehicle presented here is dedicated to the gate structure stress monitoring. It is especially very sensitive to the nitride contact etch stop layer stress level. It is shown, in particular, that the structure is able to monitor process-related stress change in the nitride layer. Its feasibility, sensitivity, and relevance in an advanced process control scheme are investigated.
Keywords :
CMOS integrated circuits; intelligent sensors; piezoresistive devices; process control; stress measurement; CMOS technologies; embedded stress sensors; mechanical stress measurement; piezoresistive sensors; process control; strained technology; stress monitoring; CMOS technology; Condition monitoring; Mechanical sensors; Mechanical variables measurement; Performance loss; Piezoresistance; Process control; Stress measurement; Technology management; Testing; Advanced process control (APC); mechanical stress; nitride film; piezoresistive sensor; strained technology;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2008.2001209
Filename :
4589035
Link To Document :
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