DocumentCode
826001
Title
A 300-mm Semiconductor Manufacturing Foreign Material Reduction Initiative
Author
Long, Christopher W. ; Sienkiewicz, Thomas ; Pfeiffer, Gerd ; Guse, Michael ; Peterman, James ; Brendler, Andrew
Author_Institution
Res. Div., IBM, Essex Junction, VT
Volume
21
Issue
3
fYear
2008
Firstpage
308
Lastpage
315
Abstract
It is well established that foreign material (FM) in a semiconductor manufacturing process can result in significant unplanned tool down time, reduced product yields, and potential reliability performance issues. This paper will present an overview of the strategy and subsequent results of a multifaceted effort to reduce FM impact during the ramp up of the IBM 300-mm semiconductor manufacturing facility in Hopewell Junction, NY.
Keywords
semiconductor device manufacture; foreign material reduction initiative; semiconductor manufacturing facility; semiconductor manufacturing process; size 300 mm; Condition monitoring; Manufacturing processes; Materials reliability; Materials testing; Metrology; Process control; Production facilities; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor materials; Foreign material (FM); monitor wafer; statistical process control; tool defect controls; variability reduction; yield enhancement;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2008.2001203
Filename
4589037
Link To Document