Title :
A 300-mm Semiconductor Manufacturing Foreign Material Reduction Initiative
Author :
Long, Christopher W. ; Sienkiewicz, Thomas ; Pfeiffer, Gerd ; Guse, Michael ; Peterman, James ; Brendler, Andrew
Author_Institution :
Res. Div., IBM, Essex Junction, VT
Abstract :
It is well established that foreign material (FM) in a semiconductor manufacturing process can result in significant unplanned tool down time, reduced product yields, and potential reliability performance issues. This paper will present an overview of the strategy and subsequent results of a multifaceted effort to reduce FM impact during the ramp up of the IBM 300-mm semiconductor manufacturing facility in Hopewell Junction, NY.
Keywords :
semiconductor device manufacture; foreign material reduction initiative; semiconductor manufacturing facility; semiconductor manufacturing process; size 300 mm; Condition monitoring; Manufacturing processes; Materials reliability; Materials testing; Metrology; Process control; Production facilities; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor materials; Foreign material (FM); monitor wafer; statistical process control; tool defect controls; variability reduction; yield enhancement;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2008.2001203
