Title :
POPFNN-CRI(S): pseudo outer product based fuzzy neural network using the compositional rule of inference and singleton fuzzifier
Author :
Ang, Kai Keng ; Quek, Chai ; Pasquier, Michel
Author_Institution :
Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore
Abstract :
A pseudo-outer product based fuzzy neural network using the compositional rule of inference and singleton fuzzifier [POPFNN-CRI(S)] is proposed in this paper. The correspondence of each layer in the proposed POPFNN-CRI(S) to the compositional rule of inference using standard T-norm and fuzzy relation gives it a strong theoretical foundation. The proposed POPFNN-CRI(S) training consists of two phases; namely: the fuzzy membership derivation phase using the novel fuzzy Kohonen partition (FKP) and pseudo Kohonen partition (PFKP) algorithms, and the rule identification phase using the novel one-pass POP learning algorithm. The proposed two-phase learning process effectively constructs the membership functions and identifies the fuzzy rules. Extensive experimental results based on the classification performance of the POPFNN-CRI(S) using the Anderson´s Iris data are presented for discussion. Results show that the POPFNN-CRI(S) has taken only 15 training iterations and misclassify only three out of all the 150 patterns in the Anderson´s Iris data.
Keywords :
fuzzy neural nets; inference mechanisms; learning (artificial intelligence); pattern classification; self-organising feature maps; POPFNN-CRI(S); classification performance; compositional rule; fuzzy Kohonen partition; fuzzy membership derivation phase; fuzzy neural network; fuzzy relation; inference; membership functions; pseudo Kohonen partition; pseudo outer product; rule identification phase; singleton fuzzifier; standard T-norm; two-phase learning process; Fuzzy logic; Fuzzy neural networks; Fuzzy sets; Fuzzy systems; Inference algorithms; Iris; Neural networks; Partitioning algorithms; Possibility theory; Uncertainty;
Journal_Title :
Systems, Man, and Cybernetics, Part B: Cybernetics, IEEE Transactions on
DOI :
10.1109/TSMCB.2003.812850