DocumentCode
82747
Title
Latched microswitches in laminates for high power 0-6.5 GHz applications
Author
Kim, Sun Ja ; Zhang, Ye ; Wang, Michael ; Bachman, Mark ; Li, G.-P.
Author_Institution
Dept. of Electr. Eng., Univ. of California, Irvine, Irvine, CA, USA
Volume
50
Issue
14
fYear
2014
fDate
July 3 2014
Firstpage
1010
Lastpage
1012
Abstract
A microswitch designed for high power radio-frequency (RF) applications is presented. A unique 3D transmission line is combined with a robust latched direct contact switch in this RF switch design. Each unit is fabricated in laminate panels before being singulated into pre-packaged micro-RF switches. High power RF tests reached 15 W at 1.9 GHz for this device. The switch has a good RF performance with -0.296 dB insertion loss and -22.03 dB isolation at 6.56 GHz.
Keywords
UHF devices; electrical contacts; flip-flops; laminates; microswitches; microwave switches; power integrated circuits; transmission lines; 3D transmission line; frequency 0 GHz to 6.5 GHz; high power radio-frequency applications; laminate panels; power 15 W; prepackaged microRF switches; robust latched direct contact microswitches;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2014.1709
Filename
6849586
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