Title :
Hybrid integration of surface-emitting microlaser chip and planar optics substrate for interconnection applications
Author :
Jahns, J. ; Morgan, R.A. ; Nguyen, H.N. ; Walker, J.A. ; Walker, S.J. ; Wong, Y.M.
Author_Institution :
AT&T Bell Lab., Holmdel, NJ, USA
Abstract :
The bonding of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors is reported. The bonding was achieved by flip-chip solder bump bonding using indium as the solder material. The alignment precision is within +or-2 mu m. The optical substrate provides a simple interconnection scheme that routes the light from each laser to well defined output positions.<>
Keywords :
integrated optoelectronics; laser accessories; lenses; mirrors; optical interconnections; semiconductor laser arrays; In; diode laser array; flip-chip solder bump bonding; glass substrate; hybrid integration; interconnection applications; interconnection scheme; matching array; microlenses; mirrors; monolithic array; optical interconnections; optical resonators; optical substrate; output positions; planar optics substrate; surface-emitting microlaser chip; Bandwidth; Bonding; Circuit simulation; Detectors; Gallium arsenide; Integrated circuit interconnections; Integrated optics; Optical interconnections; P-i-n diodes; PIN photodiodes;
Journal_Title :
Photonics Technology Letters, IEEE
