Title :
Passively assembled optical interconnection system based on an optical printed-circuit board
Author :
Hwang, Sung Hwan ; Cho, Mu Hee ; Kang, Sae-Kyoung ; Park, Hyo-Hoon ; Cho, Han Seo ; Kim, Sang-Hoon ; Shin, Kyoung-Up ; Ha, Sang-Won
Author_Institution :
Opt. Interconnection & Switching Lab., Inf. & Commun. Univ., Daejeon, South Korea
fDate :
3/1/2006 12:00:00 AM
Abstract :
We propose a passively assembled chip-to-chip optical interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded optical printed-circuit board (OPCB), optical transmitter/receiver modules, and 90°-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has been successfully demonstrated from the assembled system.
Keywords :
integrated optics; integrated optoelectronics; optical fibre communication; optical fibre losses; optical interconnections; optical receivers; optical transmitters; printed circuits; -1.5 dB; 90°-bent fiber connectors; chip-to-chip optical interconnection; fiber-embedded optical printed-circuit board; fiber-optic technology; optical interconnection system; optical link; optical printed-circuit board; optical receiver module; optical transmitter module; passive alignment; passively assembled system; precise guide holes; precise guide pins; total link loss; Assembly systems; Connectors; Optical devices; Optical fiber communication; Optical fibers; Optical interconnections; Optical losses; Optical receivers; Optical transmitters; Pins; 90; optical interconnection; optical printed-circuit board (OPCB); passive alignment;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2006.870127
