Title :
Comments on "Modeling of Metallic Carbon-Nanotube Interconnects for Circuit Simulations and a Comparison With Cu Interconnects for Sealed Technologies
Author :
Li, Hong ; Yin, Wen-Yan ; Mao, Jun-Fa
Author_Institution :
Center for Microwave & RF Technol., Shanghai Jiao Tong Univ.
Abstract :
For original paper, see Raychowdhury and Roy, IEEE Trans. Comput.-Aided Design Integr. Circuits Syst., vol.25, no.1, p.58-65, 2006 January
Keywords :
carbon nanotubes; circuit simulation; copper; electric resistance; integrated circuit interconnections; nanotube devices; Cu; circuit simulations; compact resistance; differential resistance; metallic carbon-nanotube interconnects; Capacitance; Carbon nanotubes; Circuit simulation; Inductance; Integrated circuit interconnections; Integrated circuit technology; Microwave technology; Radio frequency; Radiofrequency identification; Voltage;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
DOI :
10.1109/TCAD.2006.883920
