DocumentCode :
829448
Title :
Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method
Author :
Wei, Xing-Chang ; Li, Er-Ping ; Liu, En-Xiao ; Chua, Eng-Kee ; Oo, Zaw-Zaw ; Vahldieck, R.
Author_Institution :
Comput. Electromagn. & Electron. Div., Nat. Univ. of Singapore, Singapore
Volume :
31
Issue :
3
fYear :
2008
Firstpage :
536
Lastpage :
543
Abstract :
A novel method based on hybrid integral equation for electromagnetic emission and susceptibility modeling of power-ground planes with a finite size is proposed in this paper. First, the entire computational domain is divided into the internal subdomain including the substrate sandwiched between the power and ground planes and the external subdomain surrounding the power-ground planes. The internal subdomain is modeled by using the integral equation with dyadic Green´s functions of the rectangular cavity, while the free-space Green´s function is used to model the outside subdomain. These two kinds of integral equations are coupled through the equivalent electric and magnetic currents that are placed on the interfaces. The key advantage of this proposed method is its ability to model both emission and susceptibility problems. This method can accurately simulate the impedance of the power-ground planes and the radiated field. In particular, it is able to predict the induced electric currents inside the power-ground planes that result from external interference sources. Therefore, this technique is able to provide a complete solution for the electromagnetic compatibility analysis of the system-level package.
Keywords :
Green´s function methods; computational electromagnetics; electron emission; power semiconductor devices; semiconductor device models; computational domain; dyadic Green´s functions; electromagnetic emission; emission modeling; finite size; hybrid integral equation; internal subdomain; power ground planes; rectangular cavity; susceptibility modeling; Couplings; Current; Electromagnetic analysis; Electromagnetic compatibility; Electromagnetic modeling; Electromagnetic radiative interference; Green´s function methods; Impedance; Integral equations; Packaging; Dyadic Green´s function; electromagnetic compatibility; high-speed electronic package; integral equation; power-ground planes; simultaneous switching noise;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2008.927841
Filename :
4591499
Link To Document :
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