• DocumentCode
    829889
  • Title

    Experience with Semiconductor Logic on Package Fabricating Machines

  • Author

    Macoy, Eugene W.

  • Author_Institution
    Darien Public School System
  • Issue
    3
  • fYear
    1966
  • fDate
    5/1/1966 12:00:00 AM
  • Firstpage
    182
  • Lastpage
    190
  • Abstract
    The user has 71 major systems for multiple machine control in 15 locations in Continental United States. The systems eliminate all relays in 42 can body and heat-seal tape-applying lines which do metal piercing and forming, heating, cooling, and transferring operations. Some of these systems have performed with no maintenance since February 1964. Twenty-five cutting, piercing, sealing, and assemblying presses are similarly equipped. Four can body-former and side-seam soldering machines now operate successfully without relays, and some electronic tube devices thereon have been eliminated.
  • Keywords
    Assembly; Electronics cooling; Heat transfer; Logic; Machine control; Packaging machines; Presses; Relays; Semiconductor device packaging; Soldering;
  • fLanguage
    English
  • Journal_Title
    Industry and General Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-943X
  • Type

    jour

  • DOI
    10.1109/TIGA.1966.4180651
  • Filename
    4180651