Title :
Experience with Semiconductor Logic on Package Fabricating Machines
Author :
Macoy, Eugene W.
Author_Institution :
Darien Public School System
fDate :
5/1/1966 12:00:00 AM
Abstract :
The user has 71 major systems for multiple machine control in 15 locations in Continental United States. The systems eliminate all relays in 42 can body and heat-seal tape-applying lines which do metal piercing and forming, heating, cooling, and transferring operations. Some of these systems have performed with no maintenance since February 1964. Twenty-five cutting, piercing, sealing, and assemblying presses are similarly equipped. Four can body-former and side-seam soldering machines now operate successfully without relays, and some electronic tube devices thereon have been eliminated.
Keywords :
Assembly; Electronics cooling; Heat transfer; Logic; Machine control; Packaging machines; Presses; Relays; Semiconductor device packaging; Soldering;
Journal_Title :
Industry and General Applications, IEEE Transactions on
DOI :
10.1109/TIGA.1966.4180651