DocumentCode
829889
Title
Experience with Semiconductor Logic on Package Fabricating Machines
Author
Macoy, Eugene W.
Author_Institution
Darien Public School System
Issue
3
fYear
1966
fDate
5/1/1966 12:00:00 AM
Firstpage
182
Lastpage
190
Abstract
The user has 71 major systems for multiple machine control in 15 locations in Continental United States. The systems eliminate all relays in 42 can body and heat-seal tape-applying lines which do metal piercing and forming, heating, cooling, and transferring operations. Some of these systems have performed with no maintenance since February 1964. Twenty-five cutting, piercing, sealing, and assemblying presses are similarly equipped. Four can body-former and side-seam soldering machines now operate successfully without relays, and some electronic tube devices thereon have been eliminated.
Keywords
Assembly; Electronics cooling; Heat transfer; Logic; Machine control; Packaging machines; Presses; Relays; Semiconductor device packaging; Soldering;
fLanguage
English
Journal_Title
Industry and General Applications, IEEE Transactions on
Publisher
ieee
ISSN
0018-943X
Type
jour
DOI
10.1109/TIGA.1966.4180651
Filename
4180651
Link To Document