DocumentCode
829897
Title
An Accurate
–
Measurement Method for Highly Leaky Devices—Part I
Author
Wang, Y. ; Cheung, Kin Ping ; Choi, R. ; Lee, B.H.
Author_Institution
Rutgers Univ., Camden, NJ
Volume
55
Issue
9
fYear
2008
Firstpage
2429
Lastpage
2436
Abstract
Accurate C-V measurement becomes extremely difficult in advanced CMOS technology due to a high level of leakage across the gate dielectric. Recently, a new time-domain reflectometry (TDR)-based C-V measurement method was introduced. This new method offers ease of use and high accuracy while being able to handle a very high level of leakage current. It also allows series resistance and overlap capacitance to be extracted simultaneously and accurately without the need for additional measurement. In this paper, the theoretical basis of the TDR C-V method is described in detail, along with experimental results.
Keywords
CMOS integrated circuits; MOS capacitors; capacitance measurement; leakage currents; semiconductor device measurement; time-domain reflectometry; voltage measurement; TDR C-V measurement method; accurate capacitance-voltage measurement method; advanced CMOS technology; gate dielectric; highly leaky MOS capacitors; highly leaky devices; leakage current; time-domain reflectometry; CMOS technology; Capacitance measurement; Dielectric measurements; Electrical resistance measurement; Integrated circuit measurements; Leakage current; MOS capacitors; Radio frequency; Reflectometry; Time domain analysis; Capacitance–voltage ($C$–$V$); Capacitance–voltage ($C$ – $V$ ); RF capacitor; leakage; time domain; time-domain reflectometry (TDR); ultra thin oxide;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2008.928489
Filename
4595499
Link To Document