• DocumentCode
    829897
  • Title

    An Accurate C V Measurement Method for Highly Leaky Devices—Part I

  • Author

    Wang, Y. ; Cheung, Kin Ping ; Choi, R. ; Lee, B.H.

  • Author_Institution
    Rutgers Univ., Camden, NJ
  • Volume
    55
  • Issue
    9
  • fYear
    2008
  • Firstpage
    2429
  • Lastpage
    2436
  • Abstract
    Accurate C-V measurement becomes extremely difficult in advanced CMOS technology due to a high level of leakage across the gate dielectric. Recently, a new time-domain reflectometry (TDR)-based C-V measurement method was introduced. This new method offers ease of use and high accuracy while being able to handle a very high level of leakage current. It also allows series resistance and overlap capacitance to be extracted simultaneously and accurately without the need for additional measurement. In this paper, the theoretical basis of the TDR C-V method is described in detail, along with experimental results.
  • Keywords
    CMOS integrated circuits; MOS capacitors; capacitance measurement; leakage currents; semiconductor device measurement; time-domain reflectometry; voltage measurement; TDR C-V measurement method; accurate capacitance-voltage measurement method; advanced CMOS technology; gate dielectric; highly leaky MOS capacitors; highly leaky devices; leakage current; time-domain reflectometry; CMOS technology; Capacitance measurement; Dielectric measurements; Electrical resistance measurement; Integrated circuit measurements; Leakage current; MOS capacitors; Radio frequency; Reflectometry; Time domain analysis; Capacitance–voltage ($C$–$V$); Capacitance–voltage ($C$$V$); RF capacitor; leakage; time domain; time-domain reflectometry (TDR); ultra thin oxide;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2008.928489
  • Filename
    4595499