• DocumentCode
    832012
  • Title

    Mobility-enhancement technologies

  • Author

    Chee Wee ; Maikop, S. ; Yu, C.-Y.

  • Author_Institution
    National Taiwan Univ., Taipei, Taiwan
  • Volume
    21
  • Issue
    3
  • fYear
    2005
  • Firstpage
    21
  • Lastpage
    36
  • Abstract
    Applying stress to induce appropriate strain in the channel region of metal-oxide-semiconductor field effect transistors (MOSFETs) increases both electron and hole mobilities in the strained channel as stated in R. People (1986), J. J. Welser et al. (1994), C. K. Maiti et al. (1998) and D. J. Paul (2004). Furthermore, interest is driven by the possibility of creating electronic devices as well as integrating existing devices in different materials systems, leading to the production of integrated circuits with increased functionality and lower cost. In this article, we review various mobility enhancement techniques, such as substrate-enhancement, including stain, Ge/SiGe channels, orientations, process-induced strain, and package-strain (external mechanical strain).
  • Keywords
    CMOS integrated circuits; MOSFET; electron mobility; hole mobility; integrated circuit technology; reviews; Ge/SiGe channels; MOSFET; electron mobility; electronic devices; hole mobility; integrated circuits; mechanical strain; mobility-enhancement technologies; package strain; process-induced strain; strained channel; substrate-enhancement technique; Capacitive sensors; Charge carrier processes; Cost function; Electron mobility; FETs; Germanium silicon alloys; MOSFETs; Production systems; Silicon germanium; Stress;
  • fLanguage
    English
  • Journal_Title
    Circuits and Devices Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    8755-3996
  • Type

    jour

  • DOI
    10.1109/MCD.2005.1438752
  • Filename
    1438752