DocumentCode
832732
Title
Voltage calibration of the direct electrooptic sampling technique
Author
Hjelme, Dag R. ; Mickelson, Alan R.
Author_Institution
Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
Volume
40
Issue
10
fYear
1992
fDate
10/1/1992 12:00:00 AM
Firstpage
1941
Lastpage
1950
Abstract
A detailed study of various voltage calibration factors or the direct electrooptic sampling technique is presented. In reflection mode optical probing, the circuit substrate forms an etalon for the optical probe beam. Analytical expressions for the calibration factors due to etalon effects and decaying surface potentials are derived. on the length of the sampling pulse relative to the substrate transit time, the etalon will affect either the voltage calibration factor or the system bandwidth: For pulses that are long compared to the transient time, interference at the surface results in a probe wavelength dependent storage time effect. The resulting electrooptic signal shows a resonant behavior as a function of wavelength or substrate thickness. For pulses that are short compared to the substrate transit time, multiple reflections reduce the effective system bandwidth to a bandwidth less than that given by the single transit time or the sampling pulse width. Experimental verification of the theoretical results is presented. Various deembedding procedures for implementing the voltage calibration are discussed
Keywords
MMIC; calibration; digital integrated circuits; electro-optical devices; integrated circuit testing; microwave measurement; MMIC; circuit substrate; deembedding procedures; direct electrooptic sampling; high speed digital IC; multiple reflections; optical probe beam; reflection mode optical probing; substrate thickness; system bandwidth; voltage calibration; wavelength dependent storage time effect; Bandwidth; Calibration; Optical beams; Optical pulses; Optical reflection; Optical surface waves; Probes; Sampling methods; Surface waves; Voltage;
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
ISSN
0018-9480
Type
jour
DOI
10.1109/22.159632
Filename
159632
Link To Document