Title :
Integration of dual-mode RF bandpass filter on ceramic ball grid array package
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Chung-li, Taiwan
fDate :
9/12/2002 12:00:00 AM
Abstract :
A novel concept of integration of an RF bandpass filter on an integrated circuit package is proposed for single-chip solutions of wireless transceivers. A prototype dual-mode bandpass filter integrated on a thin ceramic ball grid array package is reported. Results show that the filter achieved 2 dB insertion loss and 6.17% bandwidth at 2.43 GHz
Keywords :
CMOS analogue integrated circuits; UHF filters; UHF integrated circuits; ball grid arrays; band-pass filters; ceramic packaging; integrated circuit packaging; microstrip filters; transceivers; 150 MHz; 2 dB; 2.43 GHz; CMOS wireless transceiver chip; ceramic ball grid array package; dual-mode RF bandpass filter integration; insertion loss; integrated circuit package; microstrip dual-mode bandpass filter; single-chip solutions; wireless transceivers;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20020747
