DocumentCode :
832995
Title :
Wear-out and breakdown of ultra-thin gate oxides after irradiation
Author :
Cester, A.
Author_Institution :
Dipt. di Ingegneria dell´´Informazione, Padova Univ., Italy
Volume :
38
Issue :
19
fYear :
2002
fDate :
9/12/2002 12:00:00 AM
Firstpage :
1137
Lastpage :
1139
Abstract :
The enhancement of gate leakage current after exposure to ionising radiation is generally believed to be the major challenge for devices and circuits operating in harsh radiation environments. How ultra-thin gate oxides subjected to heavy ion irradiation react to a subsequent electrical stress performed at low voltages has been investigated. Even in devices exhibiting small (or even negligible) enhancement of the leakage current, the time-to-breakdown is substantially reduced in comparison with unirradiated samples due to the onset of a soft or hard breakdown, in contrast with previous results found on thicker oxides
Keywords :
CMOS integrated circuits; MOS capacitors; MOSFET; dielectric thin films; ion beam effects; leakage currents; semiconductor device breakdown; CMOS components; LV electrical stress; MOS capacitors; gate leakage current enhancement; gate oxide breakdown; gate oxide wear-out; harsh radiation environments; heavy ion irradiation; ionising radiation; oxide time-to-breakdown; ultra-thin gate oxides;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20020757
Filename :
1038638
Link To Document :
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