DocumentCode
833805
Title
On-chip actuation of an in-plane compliant bistable micromechanism
Author
Baker, Michael S. ; Howell, Larry L.
Author_Institution
Dept. of Mech. Eng., Brigham Young Univ., Provo, UT, USA
Volume
11
Issue
5
fYear
2002
fDate
10/1/2002 12:00:00 AM
Firstpage
566
Lastpage
573
Abstract
A compliant bistable micromechanism has been developed which can be switched in either direction using on-chip thermal actuation. The energy storage and bistable behavior of the mechanism is achieved through the elastic deflection of compliant segments. The Pseudo-Rigid-Body Model was used for the compliant mechanism design, and for analysis of the large deflection flexible segments. To achieve on-chip actuation, the mechanism design was optimized to allow it to be switched using linear motion thermal actuators. The modeling theory and analysis are presented for three design iterations, with two iterations fabricated in the MUMP´s process and the third in the SUMMiT process.
Keywords
internal stresses; microactuators; semiconductor device models; semiconductor relays; semiconductor switches; MUMP´s process; SUMMiT process; bistable behavior; elastic deflection; energy storage; in-plane compliant bistable micromechanism; large deflection flexible segments; linear motion thermal actuators; micro relay; micro switch; on-chip thermal actuation; pseudo-rigid-body model; Design optimization; Energy consumption; Energy storage; Hydraulic actuators; Microrelays; Microswitches; Microvalves; Residual stresses; Switches; Thermal force;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2002.803284
Filename
1038852
Link To Document