• DocumentCode
    833805
  • Title

    On-chip actuation of an in-plane compliant bistable micromechanism

  • Author

    Baker, Michael S. ; Howell, Larry L.

  • Author_Institution
    Dept. of Mech. Eng., Brigham Young Univ., Provo, UT, USA
  • Volume
    11
  • Issue
    5
  • fYear
    2002
  • fDate
    10/1/2002 12:00:00 AM
  • Firstpage
    566
  • Lastpage
    573
  • Abstract
    A compliant bistable micromechanism has been developed which can be switched in either direction using on-chip thermal actuation. The energy storage and bistable behavior of the mechanism is achieved through the elastic deflection of compliant segments. The Pseudo-Rigid-Body Model was used for the compliant mechanism design, and for analysis of the large deflection flexible segments. To achieve on-chip actuation, the mechanism design was optimized to allow it to be switched using linear motion thermal actuators. The modeling theory and analysis are presented for three design iterations, with two iterations fabricated in the MUMP´s process and the third in the SUMMiT process.
  • Keywords
    internal stresses; microactuators; semiconductor device models; semiconductor relays; semiconductor switches; MUMP´s process; SUMMiT process; bistable behavior; elastic deflection; energy storage; in-plane compliant bistable micromechanism; large deflection flexible segments; linear motion thermal actuators; micro relay; micro switch; on-chip thermal actuation; pseudo-rigid-body model; Design optimization; Energy consumption; Energy storage; Hydraulic actuators; Microrelays; Microswitches; Microvalves; Residual stresses; Switches; Thermal force;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.803284
  • Filename
    1038852