DocumentCode
833971
Title
Vertically-stacked Josephson junctions using YbBa2Cu3O7-x as a counter electrode for improving uniformity
Author
Kimura, Taishi ; Wakita, Kazuya ; Yoshinaga, Yasuyuki ; Taniike, Koichiro ; Nishitani, Takashi ; Inoue, Masumi ; Fujimaki, Akira ; Hayakawa, Hisao
Author_Institution
Nagoya Univ., Japan
Volume
15
Issue
2
fYear
2005
fDate
6/1/2005 12:00:00 AM
Firstpage
145
Lastpage
148
Abstract
We have fabricated vertically-stacked interface-treated Josephson junctions using YbBa2Cu3O7-x (YbBCO) as a counter electrode for improving the uniformity. We used YBCO for the base electrode. Most of the junctions fabricated on one chip exhibited resistively-shunted-junction (RSJ) characteristics. The properties of the junctions at 4.2 K were as follows: Jc=1.0×103 A/cm2 with a 1σ spread of 6.9%, and IcRn=0.5 mV with a 1σ spread of 5.4%. These spreads were improved compared with those of junctions with YBCO as a counter electrode. Furthermore, the normal conductance Gn of the junctions with the YbBCO counter electrode was independent of the temperature. Such characteristics have not been obtained for YBCO vertically-stacked interface-treated junctions. We speculate that this difference is attributed to the lattice mismatch between base-and counter-electrodes.
Keywords
barium compounds; critical currents; high-temperature superconductors; superconducting integrated circuits; superconducting junction devices; ytterbium compounds; 0.5 mV; 4.2 K; YBCO; YbBCO; YbBa2Cu3O7-x; counter electrode; junction property; lattice mismatch; normal conductance; resistively-shunted-junction characteristics; uniformity; vertically-stacked Josephson junctions; Counting circuits; Doping; Electrodes; Etching; Fabrication; High temperature superconductors; Josephson junctions; Sputtering; Substrates; Yttrium barium copper oxide; High-temperature superconductors; Josephson junction fabrication; vertically-stacked interface-treated junctions;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2005.849719
Filename
1439597
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