• DocumentCode
    833979
  • Title

    Study of closely spaced YBa2Cu3O7-δ Josephson junction pairs

  • Author

    Chen, Ke ; Cybart, Shane A. ; Dynes, R.C.

  • Author_Institution
    Dept. of Phys., Univ. of California, La Jolla, CA, USA
  • Volume
    15
  • Issue
    2
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    149
  • Lastpage
    152
  • Abstract
    Using electron beam lithography and ion damage, high quality YBa2Cu3O7-δ superconductor-normal metal-superconductor in-plane Josephson junction pairs have been fabricated. These junctions operate at temperatures between 60 and 85 K and have spacing ranging between 150 nm and 800 nm. Central electrodes connecting to the area between the two junctions were made, allowing for simultaneous measurements of the individual junctions as well as the series. Josephson junction pairs with 150 nm spacing were found to have extraordinary properties under microwave radiation with different power. At low power the structure functioned as two independent Josephson junctions in series, while at high power it behaved as one single Josephson junction. A possible origin of this behavior could be that the applied microwave radiation induces weak link behavior in the YBa2Cu3O7-δ between the two junctions.
  • Keywords
    barium compounds; electron beam lithography; high-temperature superconductors; superconducting arrays; superconductor-normal-superconductor devices; yttrium compounds; 150 to 800 nm; 60 to 85 K; YBa2Cu3O7-δ; closely spaced Josephson junction pairs; electron beam lithography; ion damage; microwave radiation property; superconductor-normal metal-superconductor junction pairs; Electron beams; Fabrication; High temperature superconductors; Josephson junctions; Lithography; Microwave antenna arrays; Phased arrays; Physics; Superconducting materials; Superconducting microwave devices; HTS; Josephson junction; interaction; ion damage; pair;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2005.849722
  • Filename
    1439598