Title :
Carrier mobility in MOSFETs fabricated with Hf-Si-O-N gate dielectric, polysilicon gate electrode, and self-aligned source and drain
Author :
Rotondaro, A.L.P. ; Visokay, M.R. ; Shanware, A. ; Chambers, J.J. ; Colombo, L.
Author_Institution :
Silicon Technol. Dev., Texas Instrum. Inc., Dallas, TX, USA
Abstract :
A study of electron and hole mobilities for MOSFET devices fabricated with Hf-Si-O-N gate dielectric, polysilicon gate electrodes and self-aligned source and drain is presented. High effective electron and hole mobilities, 250 cm/sup 2//V/spl middot/s and 70 cm/sup 2//V/spl middot/s, respectively, were measured at high effective field (>0.5 MV/cm). The NMOSFETs have an equivalent oxide thickness (EOT) of 1.3 nm and the PMOSFETs have an EOT of 1.5 nm. The effect of interface engineering on the electron and hole mobilities is discussed.
Keywords :
MOSFET; dielectric thin films; electron mobility; hafnium compounds; hole mobility; semiconductor technology; Hf-Si-O-N gate dielectric; HfSiON-Si; MOSFETs; NMOSFETs; PMOSFETs; carrier mobility; electron mobilities; equivalent oxide thickness; high effective field; hole mobilities; interface engineering; polysilicon gate electrode; self-aligned CMOS flow; self-aligned drain; self-aligned source; Charge carrier processes; Dielectric devices; Dielectric materials; Dielectric measurements; Dielectric substrates; Electrodes; Electron mobility; Hafnium; MOSFETs; Silicon;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2002.803749
