Title :
Response surface methodology: a modeling tool for integrated circuit designers
Author :
McDonald, James ; Maini, Rajnish ; Spangler, Lou ; Weed, Harrison
Author_Institution :
Motorola Inc., Mesa, AZ, USA
fDate :
4/1/1989 12:00:00 AM
Abstract :
An approach to design is described which allows the designer to statistically analyze a circuit´s output characteristics. The results of this analysis give the designer the ability to reduce the sensitivity and to optimize these output characteristics with respect to process, package, and environmental variations. In addition, the authors demonstrate the means by which to establish output specifications before time and money are invested in fabricating devices in silicon. Finally, examples of the successful application of this technique to the design and development of an ECL (emitter-coupled logic) family are discussed. The methods for applying the results from this statistical technique to manufacturing and testing are also shown.<>
Keywords :
digital integrated circuits; emitter-coupled logic; integrated circuit technology; integrated logic circuits; logic design; statistical analysis; ECL family design; circuit output characteristics analysis; emitter-coupled logic; integrated circuit designers; manufacturing; modeling tool; output specifications; response surface methodology; sensitivity reduction; statistical technique; testing; Circuit simulation; Equations; Input variables; Integrated circuit modeling; Mathematical model; Packaging; Polynomials; Power supplies; Response surface methodology; Temperature;
Journal_Title :
Solid-State Circuits, IEEE Journal of
