Title :
Motion stages for electronic packaging design and control
Author :
Ding, Han ; Xiong, Zhenhua
Author_Institution :
Sch. of Mech. Eng., Shanghai Jiao Tong Univ.
Abstract :
This paper reviews the design and control progress of motion stages for electronics packaging, specifically, for wire bonding, due to its characteristics of high acceleration and high accuracy. The paper also introduces both conventional serial-type and new parallel-type motion stages. Several modeling techniques and many high performance control schemes are also reviewed
Keywords :
electronics packaging; lead bonding; motion control; process control; conventional serial-type motion stages; electronic packaging control; electronic packaging design; parallel-type motion stages; wire bonding; Assembly; Bonding; Electronics industry; Electronics packaging; Integrated circuit packaging; Motion control; Packaging machines; Robotics and automation; Servomotors; Wire;
Journal_Title :
Robotics & Automation Magazine, IEEE
DOI :
10.1109/MRA.2006.250562
