DocumentCode :
835928
Title :
Thermometry using thermal activation of Josephson junctions at MilliKelvin temperatures
Author :
Ohki, Thomas A. ; Wulf, Michael ; Steinman, James P. ; Feldman, Marc J. ; Bocko, Mark F.
Author_Institution :
Supercond. Digital Electron. laboratory, Univ. of Rochester, NY, USA
Volume :
15
Issue :
2
fYear :
2005
fDate :
6/1/2005 12:00:00 AM
Firstpage :
868
Lastpage :
871
Abstract :
We use the thermal activation of Josephson junctions as a thermometer to investigate heat flow from a hot resistor at milliKelvin temperatures on a silicon chip used for superconducting qubit experiments. The experiments are compared to computer simulations and agree well. These results indicate that on-chip resistors can be used below a certain power level, but not above that level.
Keywords :
heat measurement; heat transfer; resistance thermometers; silicon compounds; superconducting junction devices; superconducting processor circuits; temperature measurement; Josephson junctions; computer simulations; heat flow; hot resistor; milliKelvin temperatures; on-chip resistors; silicon chip; superconducting qubit experiments; thermal activation; thermometry; Circuits; High temperature superconductors; Josephson junctions; Quantum computing; Resistors; Substrates; Superconducting filters; Temperature sensors; Thermal conductivity; Thermal resistance;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2005.850089
Filename :
1439776
Link To Document :
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