DocumentCode
835928
Title
Thermometry using thermal activation of Josephson junctions at MilliKelvin temperatures
Author
Ohki, Thomas A. ; Wulf, Michael ; Steinman, James P. ; Feldman, Marc J. ; Bocko, Mark F.
Author_Institution
Supercond. Digital Electron. laboratory, Univ. of Rochester, NY, USA
Volume
15
Issue
2
fYear
2005
fDate
6/1/2005 12:00:00 AM
Firstpage
868
Lastpage
871
Abstract
We use the thermal activation of Josephson junctions as a thermometer to investigate heat flow from a hot resistor at milliKelvin temperatures on a silicon chip used for superconducting qubit experiments. The experiments are compared to computer simulations and agree well. These results indicate that on-chip resistors can be used below a certain power level, but not above that level.
Keywords
heat measurement; heat transfer; resistance thermometers; silicon compounds; superconducting junction devices; superconducting processor circuits; temperature measurement; Josephson junctions; computer simulations; heat flow; hot resistor; milliKelvin temperatures; on-chip resistors; silicon chip; superconducting qubit experiments; thermal activation; thermometry; Circuits; High temperature superconductors; Josephson junctions; Quantum computing; Resistors; Substrates; Superconducting filters; Temperature sensors; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2005.850089
Filename
1439776
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