• DocumentCode
    835928
  • Title

    Thermometry using thermal activation of Josephson junctions at MilliKelvin temperatures

  • Author

    Ohki, Thomas A. ; Wulf, Michael ; Steinman, James P. ; Feldman, Marc J. ; Bocko, Mark F.

  • Author_Institution
    Supercond. Digital Electron. laboratory, Univ. of Rochester, NY, USA
  • Volume
    15
  • Issue
    2
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    868
  • Lastpage
    871
  • Abstract
    We use the thermal activation of Josephson junctions as a thermometer to investigate heat flow from a hot resistor at milliKelvin temperatures on a silicon chip used for superconducting qubit experiments. The experiments are compared to computer simulations and agree well. These results indicate that on-chip resistors can be used below a certain power level, but not above that level.
  • Keywords
    heat measurement; heat transfer; resistance thermometers; silicon compounds; superconducting junction devices; superconducting processor circuits; temperature measurement; Josephson junctions; computer simulations; heat flow; hot resistor; milliKelvin temperatures; on-chip resistors; silicon chip; superconducting qubit experiments; thermal activation; thermometry; Circuits; High temperature superconductors; Josephson junctions; Quantum computing; Resistors; Substrates; Superconducting filters; Temperature sensors; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2005.850089
  • Filename
    1439776