DocumentCode
83687
Title
Self-aligning silicon interposer tiles and silicon bridges for large nanophotonics enabled systems
Author
Yang, Hyung Suk ; Zhang, Chenghui ; Bakir, Muhannad S.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
50
Issue
20
fYear
2014
fDate
September 25 2014
Firstpage
1475
Lastpage
1477
Abstract
A two-and-a-half-dimensional (2.5D) platform for enabling silicon nano-photonics and dense electrical interconnections between interposers in a tile-like configuration is presented. Three 20 × 20 mm silicon interposer tiles are assembled directly on an FR4 printed wiring board (PWB), and two 6 × 20 mm silicon bridges are assembled on top of the interposer tiles. Accurate alignment of interposer tiles to bridges, an important metric in enabling highly efficient optical coupling, is provided using positive self-alignment structures (PSASs). It is demonstrated that by using PSAS on two silicon substrates, sub-micron alignment between substrates is possible; in the cascaded configuration involving FR4, <;5 μm alignment accuracy is obtained. In addition, electrical interconnection via a bridge using mechanically flexible interconnects (MFIs) is demonstrated, which made non-bonding interconnections from one interposer tile to another via a silicon bridge, allowing silicon bridges as well as the interposer tiles to be replaced. Total silicon interposer area available is 960 mm2.
Keywords
elemental semiconductors; integrated circuit interconnections; integrated optics; nanophotonics; printed circuits; silicon; 2.5D platform; FR4 PWB; MFIs; PSASs; Si; dense electrical interconnections; highly efficient optical coupling; large nano-photonics enabled systems; mechanically flexible interconnects; nonbonding interconnections; positive self-alignment structures; self-aligning silicon interposer tiles; silicon bridges; sub-micron alignment; tile-like configuration; two-and-a-half-dimensional platform;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el.2014.1013
Filename
6908657
Link To Document