• DocumentCode
    83687
  • Title

    Self-aligning silicon interposer tiles and silicon bridges for large nanophotonics enabled systems

  • Author

    Yang, Hyung Suk ; Zhang, Chenghui ; Bakir, Muhannad S.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    50
  • Issue
    20
  • fYear
    2014
  • fDate
    September 25 2014
  • Firstpage
    1475
  • Lastpage
    1477
  • Abstract
    A two-and-a-half-dimensional (2.5D) platform for enabling silicon nano-photonics and dense electrical interconnections between interposers in a tile-like configuration is presented. Three 20 × 20 mm silicon interposer tiles are assembled directly on an FR4 printed wiring board (PWB), and two 6 × 20 mm silicon bridges are assembled on top of the interposer tiles. Accurate alignment of interposer tiles to bridges, an important metric in enabling highly efficient optical coupling, is provided using positive self-alignment structures (PSASs). It is demonstrated that by using PSAS on two silicon substrates, sub-micron alignment between substrates is possible; in the cascaded configuration involving FR4, <;5 μm alignment accuracy is obtained. In addition, electrical interconnection via a bridge using mechanically flexible interconnects (MFIs) is demonstrated, which made non-bonding interconnections from one interposer tile to another via a silicon bridge, allowing silicon bridges as well as the interposer tiles to be replaced. Total silicon interposer area available is 960 mm2.
  • Keywords
    elemental semiconductors; integrated circuit interconnections; integrated optics; nanophotonics; printed circuits; silicon; 2.5D platform; FR4 PWB; MFIs; PSASs; Si; dense electrical interconnections; highly efficient optical coupling; large nano-photonics enabled systems; mechanically flexible interconnects; nonbonding interconnections; positive self-alignment structures; self-aligning silicon interposer tiles; silicon bridges; sub-micron alignment; tile-like configuration; two-and-a-half-dimensional platform;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el.2014.1013
  • Filename
    6908657