Title :
Transverse stress effects in ITER conductors
Author :
Schultz, Joel H. ; Chiesa, Luisa ; Harris, David L. ; Lee, Peter J. ; Minervini, Joseph V. ; Senkowicz, Ben J. ; Takayasu, Makoto ; Titus, Peter
Author_Institution :
Plasma Sci. & Fusion Center, Massachusetts Inst. of Technol., Cambridge, MA, USA
fDate :
6/1/2005 12:00:00 AM
Abstract :
The International Thermonuclear Experimental Reactor (ITER) Central Solenoid and Toroidal Field Model Coils (CSMC, TFMC) and the CSMC Insert Coils using Nb33Sn had unexpectedly low current-sharing temperatures and cable "n-values." This paper argues that the anomalous effects can be explained by the high longitudinal strain due to transverse Lorentz loads. Simulated results of earlier experiments with A15 monoliths indicate that the transverse stress "multiplier" is actually a longitudinal strain multiplier due to transverse loading. Irreversible cyclic degradation effects in the cables with the lowest thermal contraction mismatches are explained by showing that a modest precompression is required to prevent tensile cracking of a significant number of individual filaments. Examination of filament breakage due to bending shows the possibility of a well-defined threshold for irreversible damage.
Keywords :
bending; fracture; fusion reactor materials; niobium alloys; plasma toroidal confinement; stress corrosion cracking; superconducting cables; superconducting coils; tensile strength; tin alloys; A15 monoliths; CSMC insert coils; ITER conductors; Nb3Sn; anomalous effects; central solenoid; current-sharing temperatures; cyclic degradation effects; filament breakage; irreversible damage; longitudinal strain multiplier; strain control; thermal contraction mismatches; toroidal field model coils; transverse Lorentz loads; transverse loading; transverse stress effects; Capacitive sensors; Coils; Conductors; Inductors; Niobium; Solenoids; Temperature; Tensile stress; Thermal stresses; Tin; ITER; Nb3Sn; strain control; superconductor;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2005.849092