Title :
Stability of Superconducting wire with various surface conditions in pressurized He II (2)-numerical analysis
Author :
Shigemasu, S. ; Ohya, M. ; Shirai, Y. ; Shiotsu, M. ; Imagawa, S.
Author_Institution :
Dept. of Energy Sci. & Technol., Kyoto Univ., Japan
fDate :
6/1/2005 12:00:00 AM
Abstract :
We developed a computer code to analyze the stability of a superconducting wire in He II based on the one-dimensional heat equation. We applied to this code our experimental data on heat transfer characteristics of He II, such as Kapitza conductance, critical heat flux and heat transfer curve in film boiling. Using this code, we simulated the recovery or quench process of a normal zone that was initiated by a thermal disturbance for the liquid helium temperatures from 1.8 K to 2.0 K at atmospheric pressure. The numerical solutions agreed with our experimental data for the same characteristics of the wire (bare and oxidized surfaces) and corresponding experimental conditions. We clarified the influences of the surface insulation and the liquid helium temperature on the stability of the superconducting wire.
Keywords :
composite materials; copper; critical current density (superconductivity); helium; mechanical stability; niobium alloys; quenching (thermal); superconducting coils; superconducting materials; thermal conductivity; titanium alloys; 1.8 to 2.0 K; 1D heat equation; Kapitza conductance; computer code; critical heat flux; film boiling; heat transfer characteristics; heat transfer curve; liquid helium temperature; numerical analysis; pressurized He II; quench process; superconducting wire stability; superfluid helium; surface condition; surface insulation; thermal disturbance; Atmospheric modeling; Conductive films; Equations; Heat transfer; Helium; Stability analysis; Superconducting filaments and wires; Superconducting films; Temperature; Thermal quenching; Kapitza conductance; stability; superfluid helium;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2005.849262