• DocumentCode
    838260
  • Title

    Design and Manufacturing of Stretchable High-Frequency Interconnects

  • Author

    Huyghe, Benoit ; Rogier, Hendrik ; Vanfleteren, Jan ; Axisa, Fabrice

  • Author_Institution
    Dept. of ELIS, Ghent Univ., Ghent
  • Volume
    31
  • Issue
    4
  • fYear
    2008
  • Firstpage
    802
  • Lastpage
    808
  • Abstract
    The increasing number of biomedical applications for electronic systems have led to the need for stretchable electronics in order to significantly enhance the comfort of the user. This paper describes the design and manufacturing process of new stretchable high-frequency interconnects with meander-shaped conductors in a coplanar waveguide topology. The novel interconnects are produced based on laser-ablation of a copper foil, which is then embedded in a highly stretchable bio-compatible silicone material. Measurements on prototypes of the designed stretchable high-frequency interconnects revealed a maximal magnitude of -14 dB for the reflection coefficient and a minimal magnitude of -4 dB for the transmission coefficient in the frequency band up to 3 GHz. The influence of stretch on the performance of the high-frequency interconnects was analyzed using a stretch testing machine. The results showed that nor the magnitude, neither the phase of the transmission coefficient was influenced by elongations up to 20%.
  • Keywords
    biomedical electronics; coplanar waveguides; flexible electronics; integrated circuit interconnections; laser ablation; antenna feeds; biocompatible silicone material; biomedical electronics; coplanar waveguide topology; coplanar waveguides; copper foil laser ablation; meander-shaped conductors; stretchable high-frequency interconnects; Antenna feeds; biomedical electronics; coplanar waveguides; packaging; planar transmission lines; silicone insulation; stretchable electronics; technological innovation;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2008.927811
  • Filename
    4601494