Title :
Optimum computation of capacitance coefficients of multilevel interconnecting lines for advanced package
Author :
Ahmadouche, A. ; Chilo, J.
Author_Institution :
Lab. d´´Electromagn., Grenoble Univ., France
fDate :
3/1/1989 12:00:00 AM
Abstract :
A general procedure for computing the capacitance coefficients of multilevel interconnections in multilayered dielectric medium is given. The electromagnetic concept of total charge density is applied. It makes it possible to obtain integral equations between scalar potential and charge density distributions. These equations are solved by the method of moments technique. To optimize the computational algorithm, special consideration is given to the limitation of the dimensions of the dielectric interfaces. Simple criteria are introduced to divide the interfaces into an optimum number of elementary parts. Theoretical results thus obtained agree closely with the experimental results from test vehicles.<>
Keywords :
capacitance; packaging; printed circuit design; transmission line theory; advanced package; capacitance coefficients; charge density distributions; computational procedure optimisation; electromagnetic concept; experimental results; integral equations; method of moments; multilayered dielectric medium; multilevel interconnecting lines; multilevel interconnections; optimum number of elementary parts; scalar potential; total charge density; Capacitance; Computer interfaces; Dielectrics; Green´s function methods; Integral equations; Integrated circuit interconnections; Packaging; Space charge; Transmission line matrix methods; Vehicles;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
