Title :
Module placement with boundary constraints using B*-trees
Author :
Lin, J.-M. ; Yi, H.-E. ; Chang, Y.-W.
Author_Institution :
Dept. of Comput. & Inf. Sci., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fDate :
8/1/2002 12:00:00 AM
Abstract :
The module placement problem is to determine the co-ordinates of logic modules in a chip such that no two modules overlap and some cost (e.g. silicon area, interconnection length, etc.) is optimised. To shorten connections between inputs and outputs and/or make related modules adjacent, it is desired to place some modules along the specific boundaries of a chip. To deal with such boundary constraints, we explore the feasibility conditions of a B*-tree with boundary constraints and develop a simulated annealing-based algorithm using B*-trees. Unlike most previous work, the proposed algorithm guarantees a feasible B*-tree with boundary constraints for each perturbation. Experimental results show that the algorithm can obtain a smaller silicon area than the most recent work based on sequence pairs
Keywords :
logic CAD; modules; simulated annealing; trees (mathematics); B*-tree; boundary constraints; interconnection length; logic module placement; silicon area; simulated annealing algorithm;
Journal_Title :
Circuits, Devices and Systems, IEE Proceedings -
DOI :
10.1049/ip-cds:20020433