DocumentCode
838963
Title
Analysis of current flow in polycrystalline TFTs
Author
Eccleston, William
Author_Institution
Dept. of Electr. Eng. & Electron., Univ. of Liverpool, UK
Volume
53
Issue
3
fYear
2006
fDate
3/1/2006 12:00:00 AM
Firstpage
474
Lastpage
480
Abstract
A model for predicting the change of currents at the surface of polycrystalline materials for both ohmic and blocking contacts is developed. The model includes electron/hole traps within grain boundaries that are comparable in thickness to that of the dielectric on the surface of the polycrystalline semiconductor. The grains and their interfaces with the dielectric are assumed to be trap free. Account is also taken of the reducing carrier Debye Length as the surface carrier concentration is increased, from its intrinsic value, by the field effect. The net surface conductance is obtained by integrating the carrier density across the surface region through to the back of the material. Four regimes are identified: quasi-drift and quasi-diffusion for the high and low current regimes when there is a good supply of carriers and generation and quasi-diffusion when there is a limited supply of carriers. The analytical relationships are found to give satisfactory agreement with results for the temperature and field dependence of surface conductance in polycrystalline silicon in these regimes. The dependence of surface conductance on field effect voltage is found, at lower currents, to be a means of determining the energy distribution of electron/hole traps.
Keywords
carrier density; electron traps; grain boundaries; hole traps; ohmic contacts; semiconductor device models; surface conductivity; thin film transistors; Debye length; blocking contacts; carrier density; current flow analysis; electron-hole traps; energy distribution; field effect voltage; grain boundaries; high current regime; low current regimes; ohmic contact; polycrystalline TFT; polycrystalline materials; quasidiffusion regime; quasidrift regime; surface carrier concentration; surface conductance; Charge carrier density; Charge carrier processes; Conducting materials; Dielectric materials; Electron traps; Grain boundaries; Predictive models; Semiconductor materials; Silicon; Temperature dependence; Models; off current; on current; polysilicon;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2005.864388
Filename
1597523
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