Characteristics of the full CMOS SRAM cell using body-tied TG MOSFETs (bulk FinFETs)

In this paper,the operational six-transistor SRAM cell characteristic was demonstrated using body-tied triple-gate MOSFETs (bulk FinFETs). A cell size of 0.79 μm² was achieved with 90-nm node technology, using four levels of W and Al interconnects. A static noise margin of 280 mV was obtained at V_CC of 1.2 V by applying bulk FinFETs, and compared with those of typical optimized control devices and nanoscale planar channel MOSFETs. The characteristics of the bulk FinFETs were compared with those of nanoscale planar channel MOSFETs, and analyzed in detail by changing nanoscale active width (or fin width). Fabrication process issues for the bulk FinFETs were explained in terms of poly-Si gate over-etching and silicidation on nanoscale fin bodies. Also, input and output characteristics of the individual and parallel arrayed transistors were shown and analyzed.