• DocumentCode
    839224
  • Title

    Characterization of ultrafast devices using near-field optical heterodyning

  • Author

    Ali, M.E. ; Geary, K. ; Fetterman, H.R. ; Han, S.K. ; Kang, K.Y.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • Volume
    12
  • Issue
    10
  • fYear
    2002
  • Firstpage
    369
  • Lastpage
    371
  • Abstract
    We demonstrate a novel technique for highly localized injection of millimeter waves in ultrafast devices that combines optical heterodyning and near-field optics. The technique relies on evanescent coupling of two interfering lasers to a submicron area of a device by means of a near-field fiber optic probe. Scanning measurements show the dc and ac photoresponses of two ultrafast device structures, namely low-temperature GaAs photoconductive switches and InP-based high electron mobility transistors. The response characteristics were rich in structures that revealed important details of device dynamics.
  • Keywords
    III-V semiconductors; dynamic response; fibre optic sensors; gallium arsenide; heterodyne detection; high electron mobility transistors; high-speed optical techniques; indium compounds; measurement by laser beam; microwave photonics; millimetre wave field effect transistors; optical signal detection; photoconducting switches; semiconductor device testing; AlAs-InGaAs-InP; GaAs; InP-based high electron mobility transistors; ac photoresponse; dc photoresponse; device dynamics; highly localized millimeter wave injection; interfering laser evanescent coupling; low-temperature GaAs photoconductive switches; near-field fiber optic probe; near-field optical heterodyning; scanning measurements; submicron area; ultrafast devices; Electron optics; Millimeter wave devices; Millimeter wave measurements; Millimeter wave technology; Millimeter wave transistors; Optical coupling; Optical devices; Optical mixing; Optical surface waves; Ultrafast optics;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2002.804553
  • Filename
    1040275