Title :
GaN HFET digital circuit technology for harsh environments
Author :
Hussain, T. ; Micovic, M. ; Tsen, T. ; Delaney, M. ; Chow, D. ; Schmitz, A. ; Hashimoto, P. ; Wong, D. ; Moon, J.S. ; Hu, Ming ; Duvall, J. ; McLaughlin, D.
Author_Institution :
HRL Labs., Malibu, CA, USA
Abstract :
The first demonstration of GaN digital circuits is reported. First-generation GaN digital technology has already shown high yields for circuits of considerable complexity. Specifically, a 31-stage ring oscillator was implemented using 217 transistors. Properties of the AlGaN/GaN material system that enable outstanding power handling capabilities of GaN heterojunction field effect transistors (HFETs), i.e. large bandgap, high breakdown field and high saturation velocity, also make it attractive for digital applications in harsh environments. Because of these unique material characteristics, GaN digital control circuits have the potential to operate in high radiation environments, at elevated temperatures, and directly from high voltage rails. Successful operation of GaN 31-stage ring oscillators at the highest base-plate temperature attainable by the test setup of 265°C, indicates that these circuits can operate at significantly higher temperatures.
Keywords :
III-V semiconductors; aluminium compounds; field effect transistor circuits; gallium compounds; high-temperature electronics; integrated circuit design; integrated circuit measurement; logic circuits; wide band gap semiconductors; 265 degC; AlGaN-GaN; AlGaN/GaN material characteristics; GaN HFET digital circuit technology; base-plate temperature; elevated temperature operation; harsh environments; heterojunction field effect transistors; high breakdown field; high circuit yield; high radiation environments; high saturation velocity; high voltage operation; large bandgap; ring oscillators;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20031129