DocumentCode
840247
Title
Influence of compressive length of normal stress on degradation in Bi-2223 tapes
Author
Takao, Tomoaki ; Ito, Toru ; Umekawa, Kenji ; Fukasawa, Yuta ; Tanaka, Hideki ; Umeda, Masaichi
Author_Institution
Dept. of Electr. & Electron. Eng., Sophia Univ., Tokyo, Japan
Volume
15
Issue
2
fYear
2005
fDate
6/1/2005 12:00:00 AM
Firstpage
2488
Lastpage
2491
Abstract
We have applied transversal-compressive force to typical Bi-2223 tapes with multi-filaments and a Ag-alloy matrix. The degradation of superconducting performance of the tapes against the compressive force was measured. In the experiment, damaged lengths along the tape were changed, and hence, the dependence of the damaged lengths on the Ic degradation were also evaluated. According to the experimental results, in spite of the same stress to the tapes, the Ic degradation clearly depended on the loaded length along the tape. Therefore, the superconducting property degraded with increasing of the damaged length. When the transversal-compressive force is applied to the tape surfaces, it should be carefully noted that the degradation depends on the damaged length along the tape.
Keywords
bismuth compounds; calcium compounds; compressive strength; compressive testing; critical currents; force; high-temperature superconductors; lead compounds; multifilamentary superconductors; plastics; silver alloys; stress effects; strontium compounds; superconducting tapes; 10 mm; 3 to 6 mm; Bi2PbSr2Ca2Cu3O10; compressive length; critical current degradation; damaged lengths; multifilaments; normal stress; silver alloy matrix; superconducting performance degradation; superconducting tape surfaces; transversal compressive force; Compressive stress; Conductors; Critical current; Degradation; Fiber reinforced plastics; Force measurement; Magnetic field measurement; Multifilamentary superconductors; Superconducting films; Superconducting magnets; Bi-2223; compressive stress; critical current; degradation;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2005.847495
Filename
1440170
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