Title :
Development of Bi-2223 superconducting wires for AC applications
Author :
Ayai, Naoki ; Hayashi, Kazuhiko ; Yasuda, Kenji
Author_Institution :
Sumitomo Electr. Ind. Ltd., Osaka, Japan
fDate :
6/1/2005 12:00:00 AM
Abstract :
Advanced silver sheathed Bi-2223 superconducting tapes have been developed for AC-applications such as electric power cables and transformers, which require reduced AC-losses. Twisted multi-filament and inter-filament resistive barriers were applied to eliminate the electromagnetic inter-filament coupling, which is the primary mechanism in enhancing AC-losses. A multi-filamentary wire with a honeycomb type thin ceramic barrier was designed and manufactured in an attempt to realize low AC-losses without degrading the transport properties of the conductor. AC-losses of the manufactured wire were reduced drastically when compared to those of conventional wires without barriers. Using the measured properties of the manufactured wire as a basis, a design study along with projected AC-losses for a superconducting power cable is presented.
Keywords :
bismuth compounds; calcium compounds; cores; high-temperature superconductors; lead compounds; losses; multifilamentary superconductors; silver; strontium compounds; superconducting cables; superconducting tapes; superconducting transformers; AC applications; AC losses; Bi-2223 superconducting wires; Bi2PbSr2Ca2Cu3O10-Ag; electromagnetic interfilament coupling; honeycomb type thin ceramic barrier; interfilament resistive barriers; multifilamentary wire; silver sheathed Bi-2223 superconducting tapes; superconducting power cable; superconducting transformers; superconductor transport property; twisted multifilament resistive barriers; Ceramics; Conductors; Degradation; Electromagnetic coupling; Manufacturing; Silver; Superconducting cables; Superconducting filaments and wires; Superconducting films; Transformers; AC-losses; Bi-2223; high-temperature superconductors; superconducting cables; superconducting tapes;
Journal_Title :
Applied Superconductivity, IEEE Transactions on
DOI :
10.1109/TASC.2005.847507