DocumentCode :
840735
Title :
Effects of heating rate in calcination process on microstructures of Y123 precursor and final films formed by advanced TFA-MOD method
Author :
Matsuda, Junko S. ; Nakaoka, Koichi ; Tokunaga, Yoshitaka ; Teranishi, Ryo ; Koyama, Satoshi ; Aoki, Yuji ; Fuji, Hiroshi ; Yajima, Akimasa ; Yamada, Yutaka ; Izumi, Teruo ; Shiohara, Yuh
Author_Institution :
Supercond. Res. Lab., Tokyo, Japan
Volume :
15
Issue :
2
fYear :
2005
fDate :
6/1/2005 12:00:00 AM
Firstpage :
2652
Lastpage :
2655
Abstract :
We have investigated the effects of heating rates in the calcination process on microstructures of Y123 precursor and final films. As a result, it was found that there is CuO segregation in the vicinity of the Y123 precursor film surface, when the precursor is prepared at a rapid heating rate in the calcination. In the case of heat-treating this precursor film in the crystallization process, many large pores and misoriented Y123 crystals tend to remain in the Y123 final film. It is important to control the heating rate in the calcination, in order to attain higher JC of the Y123 final films.
Keywords :
barium compounds; calcination; critical current density (superconductivity); crystal microstructure; crystallisation; high-temperature superconductors; superconducting thin films; yttrium compounds; CuO segregation; Y123 crystal; Y123 precursor film surface; YBa2Cu3O7; advanced TFA-MOD Method; calcination process; crystallization process; film microstructure; heating rate; metal organic deposition; superconducting tape; transmission electron microscopy; Calcination; Coatings; Crystallization; Heating; Laboratories; Microstructure; Substrates; Superconducting films; Superconductivity; Transmission electron microscopy; Metal organic deposition; superconducting tapes; transmission electron microscopy; yttrium compounds;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2005.847759
Filename :
1440212
Link To Document :
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