Title :
A MEMS Inertia Switch With Bridge-Type Elastic Fixed Electrode for Long Duration Contact
Author :
Yang, Zhuoqing ; Ding, Guifu ; Cai, Haogang ; Zhao, Xiaolin
Author_Institution :
Res. Inst. of Micro/Nanometer Sci. & Technol., Shanghai Jiao Tong Univ., Shanghai
Abstract :
A multilayer structural inertia microswitch with a bridge-type elastic fixed electrode for long duration contact has been designed and fabricated based on surface micromachining technology. The microswitch mainly consists of a suspended thick proof mass as a movable electrode and two parallel elastic beams with holes as a fixed electrode. The proof mass is designed to be much thicker than attached snake spring section. As a new type of fixed electrode, the bridge-type elastic beams can effectively improve the contact of the microswitch. The packaged microswitch (3.2 times 2.1 times1.3 mm3) has been tested and characterized by a dropping hammer system. The response time and the contact time of the microswitch are about 0.25 ms and 12 mus, respectively, when 100 g acceleration is applied, which indicates a better contact effect than current reported switches. Dependence of the contact time on the thickness of the parallel beam under applied acceleration of 100 g has been discussed. The contact time increases as the thickness of the parallel elastic beam decreases. The test data have an agreement with dynamic finite element simulation results.
Keywords :
finite element analysis; mechanical contact; microelectrodes; micromechanical devices; microswitches; MEMS inertia switch; bridge-type elastic fixed electrode; contact effect; dropping hammer system; dynamic finite element simulation; multilayer structural inertia microswitch; parallel elastic beam; surface micromachining technology; time 0.25 ms; time 12 mus; Acceleration; Contacts; Electrodes; Micromachining; Micromechanical devices; Microswitches; Nonhomogeneous media; Packaging; Springs; Switches; Contact dynamics simulation; dropping test; inertia switch; microelectromechanical system (MEMS); surface micromachining;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2008.927385