• DocumentCode
    841484
  • Title

    A Performance Tradeoff Function for Evaluating Suggested Parameters in the Reactive Ion Etching Process

  • Author

    Lau, H.C.W. ; Tang, C.X.H. ; Leung, B.P.K. ; Lee, C.K.M. ; Ho, G.T.S.

  • Author_Institution
    Dept. of Ind. & Syst. Eng., Hong Kong Polytech. Univ., Kowloon
  • Volume
    39
  • Issue
    4
  • fYear
    2009
  • fDate
    7/1/2009 12:00:00 AM
  • Firstpage
    933
  • Lastpage
    938
  • Abstract
    Reactive ion etching (RIE) is a process in the fabrication of semiconductor devices. The ability to predict the influence of the process parameters of RIE is crucial in terms of machine performance as they may have a serious impact on product quality as well as on the probability of machine failure. To address this issue, this correspondence paper presents a novel performance tradeoff function for evaluating the overall suitability of adopting the predicted control parameters suggested by domain experts, taking into full consideration their impact on the performance of the machine involved. An experiment using the RIE machine is provided to validate the practicability of the proposed approach.
  • Keywords
    semiconductor devices; sputter etching; machine failure probability; performance tradeoff function; product quality; reactive ion etching process; semiconductor device fabrication; Global optimization; inverted beta loss function; machine performance; process parameter setting;
  • fLanguage
    English
  • Journal_Title
    Systems, Man and Cybernetics, Part A: Systems and Humans, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4427
  • Type

    jour

  • DOI
    10.1109/TSMCA.2009.2019877
  • Filename
    4912357