DocumentCode
841484
Title
A Performance Tradeoff Function for Evaluating Suggested Parameters in the Reactive Ion Etching Process
Author
Lau, H.C.W. ; Tang, C.X.H. ; Leung, B.P.K. ; Lee, C.K.M. ; Ho, G.T.S.
Author_Institution
Dept. of Ind. & Syst. Eng., Hong Kong Polytech. Univ., Kowloon
Volume
39
Issue
4
fYear
2009
fDate
7/1/2009 12:00:00 AM
Firstpage
933
Lastpage
938
Abstract
Reactive ion etching (RIE) is a process in the fabrication of semiconductor devices. The ability to predict the influence of the process parameters of RIE is crucial in terms of machine performance as they may have a serious impact on product quality as well as on the probability of machine failure. To address this issue, this correspondence paper presents a novel performance tradeoff function for evaluating the overall suitability of adopting the predicted control parameters suggested by domain experts, taking into full consideration their impact on the performance of the machine involved. An experiment using the RIE machine is provided to validate the practicability of the proposed approach.
Keywords
semiconductor devices; sputter etching; machine failure probability; performance tradeoff function; product quality; reactive ion etching process; semiconductor device fabrication; Global optimization; inverted beta loss function; machine performance; process parameter setting;
fLanguage
English
Journal_Title
Systems, Man and Cybernetics, Part A: Systems and Humans, IEEE Transactions on
Publisher
ieee
ISSN
1083-4427
Type
jour
DOI
10.1109/TSMCA.2009.2019877
Filename
4912357
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