مرکز منطقه ای اطلاع رساني علوم و فناوري - Foreword Special Section on Packaging for Micro/Nano-Scale Systems

DocumentCode :

841748

Title :

Foreword Special Section on Packaging for Micro/Nano-Scale Systems

Author :

Chiou, J. Albert ; Lee, Y. C. ; Kurabayashi, Katsuo ; Candler, R.

Volume :

Issue :

fYear :

2009

fDate :

5/1/2009 12:00:00 AM

Firstpage :

399

Lastpage :

401

Abstract :

The 11 papers in this special section focus in packaging for micro/nano-scale systems.

fLanguage :

English

Journal_Title :

Advanced Packaging, IEEE Transactions on

Publisher :

ieee

ISSN :

1521-3323

Type :

jour

DOI :

10.1109/TADVP.2009.2021387

Filename :

4912381

Link To Document :